CMOS技术中的集成化学微传感系统

Preface1 Introduction2 Fundamentals of Chemical Sensing 3 Microtechnology for Chemical Sensors 3.1 Microtechnology Substrate Materials 3.2 Fundamental Semiconductor Processing Steps 3.2.1 Deposition 3.2.2 Patterning 3.2.3 Etching 3.2.4 Doping. 3.3 CMOS Technology 3.4 Microfabrication for Chemical Sensors 3.4.1 Micromachining for Chemical Microsensors 3.4.1.1 Bulk Micromachining 3.4.1.2 Surface Micromachining 3.4.2 Wafer Bonding 3.4.3 Sensitive-Layer Deposition4 Microfabricated Chemical Sensors 4.1 Chemomechanical Sensors 4.1.1 Rayleigh SAW Devices 4.1.2 Flexural-Plate-Wave or Lamb-Wave Devices 4.1.3 Resonating Cantilevers 4.2 Thermal Sensors 4.2.1 Catalytic Thermal Sensors (Pellistors) 4.2.2 Thermoelectric or Seebeck-Effect Sensors 4.3 Optical Sensors 4.3.1 Integrated Optics 4.3.2 Microspectrometers 4.3.2.1 Fabry-Perot-Type Structures 4.3.2.2 Grating-Type Structures 4.3.3 Bioluminescent Bioreporter Integrated Circuits (BBIC) 4.3.4 Surface Plasmon Resonance (SPR) Devices 4.4 Electrochemical Sensors 4.4.1 Voltammetric Sensors 4.4.2 Potentiometric Sensors 4.4.2.1 Electrochemical Cell 4.4.2.2 Field-Effect-Based Devices 4.4.2.2.1 MOS Field-Effect Transistors, MOSFETS, and Ion-Selective Field- Effect Transistors, ISFETs (Chemotransistors) 4.4.2.2.2 MOS Diode and Ion-Controlled Diode, ICD (Chemodiodes) 4.4.2.2.3 MOS Capacitor and Ion-Selective Capacitor (Chemocapacitors) 4.4.2.2.4 Measuring Work Functions: Kelvin Probe and Suspended-Gate Field-Effect Transistor, SGFET 4.4.2.2.5 Light-Addressable Potentiometric Sensor, LAPS 4.4.2.2.6 Field-Effect Device Fabrication 4.4.3 Conductometric Sensors 4.4.3.1 Chemoresistors 4.4.3.1.1 Low-Temperature Chemoresistors 4.4.3.1.2 High-Temperature Chemoresistors (Hotplate Sensors) 4.4.3.2 Chemocapacitors5 CMOS Platform Technology for Chemical Sensors 5.1 CMOS Capacitive Microsystems 5.1.1 CMOS Capacitive Transducer 5.1.2 On-Chip Circuitry of the Capacitive Microsystem 5.1.3 Capacitive Gas Sensing 5.1.3.1 Selectivity Through Sensitive Layer Thickness 5.1.3.2 Insensitivity to Low-E Analytes 5,1.3.3 Humidity Interference 5.2 CMOS Calorimetric Device 5.2.1 CMOS Calorimetric Transducer 5.2.2 Calorimeter Circuitry 5.2.3 Calorimetric Gas Sensing 5.3 CMOS Integrated Resonant Cantilever 5.3.1 Resonant Cantilever Transducers 5.3.1.1 Thermal Actuation 5.3.1.2 Magnetic Actuation 5.3.1.3 Vibration Detection 5.3.1.4 Cantilever Temperature 5.3.2 Microcantilever Circuitry 5.3.2.1 Thermal Actuation 5.3.2.2 Magnetic Actuation 5.3.3 Microcantilevers as Chemical Sensors 5.3.3.1 Polymer Coating 5.3.3.2 Analyte Absorption 5.3.4 Comparison of Cantilevers to Other Mass-Sensitive Devices 5.4 CMOS Microhotplate System Development 5.4.1 CMOS Microhotplates 5.4.1.1 Temperature Sensor Calibration 5.4.1.2 Thermal Microhotplate Modeling and Characterization 5.4.1.3 Microhotplate Heaters: Resistor and Transistor 5.4.1.4 Microhotplate Sensor Fabrication 5.4.2 Hotplate-Based CMOS Monolithic Microsystems 5.4.2.1 Analog Hotplate Microsystem 5.4.2.2 Analog/Digital Hotplate Microsystem 5.4.2.3 Digital Hotptate Array Microsystem 5.5 CMOS Chemical Multisensor Systems 5.5.1 CMOS Multiparameter Biochemical Microsystem 5.5.2 CMOS Gas-Phase Multisensor System 5.5.2.1 Multisystem Architecture 5.5.2.2 Multisystem Circuitry Components, Design and Fabrication 5.5.2.3 Multisystem Gas Sensor Measurements 5.5.2.4 Multisystem Applications and Operation Modes 5.6 CMOS Chemical Microsensor and System Packaging 5.6.1 Simple Epoxy-Based Package 5.6.2 Chip-on-Board Package 5.6.3 Flip-Chip Package ,6 Outlook and Future DevelopmentsReferencesAbbreviationsIndex