钎焊手册

目录 \n
Contents \n
第3版前言Preface of the Third Edition \n
第2版前言Preface of the Second Edition \n
第1版前言Preface of the First Edition \n
第1章绪论Chapter 1 Introduction1 \n
1.1钎焊方法的原理和特点Principle and Characteristic of Brazing and Soldering Technique1 \n
1.2熔态钎料对固体母材的润湿和铺展Wetting and Spreading of Molten Filler Metal on a Solid Base Metal1 \n
1.2.1固体金属的表面结构The Surface Structure of Solid Metal1 \n
1.2.2熔态钎料与固体母材的润湿Wetting of Molten Filler on Solid Base Metal2 \n
1.2.3熔态钎料在钎剂(第二液体)中与母材间界面张力的变化Change of Interfacial Tension between Molten Filler and Base Metal Immersed in a Fused Flux(a second liquid)4 \n
1.2.4金属母材表面的氧化膜及其去除机制Oxide Film on Base Metal and its Removal Mechanism6 \n
1.2.5熔态钎料在固体母材上的铺展Spreading of Molten Filler Metal on Solid Base Metal7 \n
1.3熔态钎料与固体母材的相互作用Reaction of Molten Filler with Solid Base Metal9 \n
1.3.1熔态金属与固体金属的相互作用Reaction of Molten Metal with Solid Metal9 \n
1.3.2钎料的构成Construction of Filler Metals11 \n
1.3.3熔态钎料在母材间隙中的流动和钎缝结构的不均匀性Flowing of Molten Filler Metal in the Clearance of Base Metals as well as Inhomogeneity of the Formed Fillet14 \n
1.3.4熔析与熔蚀Liquation and Erosion15 \n
1.4钎缝中熔态钎料的凝固和钎缝的金相组织Solidification of Molten Filler Metal in Clearance and the Micrographic Structure of the Fillet16 \n
1.4.1共晶钎缝组织The Structure of Eutectic Fillet16 \n
1.4.2晶间渗透组织The Fillet Structure with Intercrystalline Penetration16 \n
1.4.3有化合物生成的钎缝组织The Fillet Structure with Intermetallics17 \n
1.5钎剂、钎料的选择与搭配Selection and Matching of Fluxes with Filler Metals18 \n
1.5.1钎剂的选择Selection of Fluxes18 \n
1.5.2钎料的选择Selection of Filler Metals20 \n
1.5.3钎剂和钎料的搭配Matching of Filler Metal with Flux21 \n
1.6钎焊工艺Technology of Brazing and Soldering21 \n
1.6.1接头的形式与钎料在钎缝中的流动性Joint Types and Flowability of Molten Filler Metal in the Clearance21 \n
1.6.2加热方法Methods for Heating22 \n
1.6.3工件的升温速度和冷却速度Heating and Cooling Rate of Workpieces in Brazing Process23 \n
1.6.4钎焊接头的保温处理和结构的弥散Annealing for Brazed Joints and Structure Dispersion in the Fillet23 \n
参考文献References25 \n
第2章铝及铝合金的钎焊Chapter 2 Brazing and Soldering of Aluminum and its Alloys27 \n
2.1概述Introduction27 \n
2.2铝及铝合金的编号Designations of Aluminum and its Alloys27 \n
2.3铝及铝合金的理化性能Physical and Chemical Properties of Aluminum and its Alloys28 \n
2.3.1铝及铝合金的物理性能Physical Properties of Aluminum and its Alloys28 \n
2.3.2铝及铝合金的化学性能Chemical Properties of Aluminum and its Alloys39 \n
2.4铝氧化膜的本质及其在加热时的变化Nature of Oxide Film on Aluminum and its Change during Heating40 \n
2.5铝钎剂Fluxes for Aluminum Brazing and Soldering41 \n
2.5.1铝的硬钎剂Fluxes for Aluminum Brazing41 \n
2.5.2铝的软钎剂Fluxes for Aluminum Soldering53 \n
2.6钎焊时铝氧化膜的脱除机制Removal Mechanism of Oxide Film on Aluminum during Brazing55 \n
2.6.1铝氧化膜与熔盐钎剂的相互作用Interaction of Oxide Film on Aluminum with Molten Salt Flux55 \n
2.6.2真空环境下金属蒸气对铝氧化膜的破坏Disruption of Oxide Film on Aluminum by Metal Vapor in Vacuum Environment57 \n
2.7铝钎料Brazing Filler Metals and Solders for Aluminum Alloys58 \n
2.7.1Al-Si系钎料(液相线温度范围570～630°C)Filler Metals of Al-Si Series(melting range 570～630°C)58 \n
2.7.2Al-Si-Cu-Zn系钎料(液相线温度范围500～577°C)Filler Metals of Al-Si-Cu-Zn Series(melting range 500～577°C)60 \n
2.7.3Al-Cu-Ag-Zn系钎料(液相线温度范围400～500°C)Filler Metals of Al-Cu-Ag-Zn Series(melting range 400～500°C)61 \n
2.7.4Al-Ge-Si系钎料(液相线温度范围425～500°C)Filler Metals of Al-Ge-Si Series (melting range 425～500°C)61 \n
2.7.5Zn-Al系钎料(液相线温度范围382～400°C)Solders of Zn-Al Series(melting range 382～400°C)62 \n
2.7.6Cd-Zn系钎料(液相线温度范围265～350°C)Solders of Cd-Zn Series(melting range 265～350°C)64 \n
2.7.7Sn-Zn系钎料(液相线温度范围198～260°C)Solders of Sn-Zn Series(melting range 198～260°C)64 \n
2.7.8Sn-Pb系钎料(液相线温度范围183～270°C)Solders of Sn-Pb Series(melting range 183～270°C)65 \n
2.7.9Pb-Bi系钎料(液相线温度范围124～200°C)Solders of Pb-Bi Series(melting range 124～200°C)66 \n
2.8铝的复合钎焊材料Composite Fillers for Aluminum Brazing or Soldering66 \n
2.8.1铝钎焊板Aluminum Brazing Sheets66 \n
2.8.2药芯及药皮铝钎焊丝Flux Cored and Flux Coated Filler Metals for Aluminum Brazing or Soldering67 \n
2.8.3钎料-钎剂粉烧结的复合铝钎焊条(丝)Composites of Sintered Powder Filler Metals with Flux for Aluminum Brazing68 \n
2.8.4铝钎料膏Aluminum Brazing Paste68 \n
2.9铝钎焊中的一些特殊技艺Some Special Skills in Aluminum Brazing and Soldering68 \n
2.9.1用金属镓来作为界面活性剂进行铝合金零件的精密扩散钎焊Gallium Used as a Surfactant for Precise Soldering of Aluminum Alloy Parts68 \n
2.9.2用锗粉进行铝合金的无钎剂扩散钎焊Fluxless Diffusion Brazing of Aluminum Alloys with Germanium Powders69 \n
2.9.3铝及铝合金的表面软钎焊钎涂改性Surface Modification of Aluminum Alloys by Solder-coating69 \n
2.9.4铝的自钎软钎剂Self-soldering Flux Used for Soldering Aluminum Alloy Parts69 \n
2.9.5铝合金面上敷以Nocolok钎剂-硅粉-合成树脂复合涂层A Composite Coating on Aluminum Alloys Made by Resinized Silicon and Nocolok Flux70 \n
2.10铝钎焊的焊前准备和焊后处理Pre-brazing Preparations and Post-brazing Operations70 \n
2.10.1接头和夹具的设计Joint and Jig Design70 \n
2.10.2工件的预清洗Pre-cleaning of Workpieces to be Brazed72 \n
2.10.3工件焊后的清洗Post-braze Cleaning of Workpieces74 \n
2.10.4镀覆Finishing75 \n
参考文献References76 \n
第3章铜和铜合金的钎焊Chapter 3 Brazing and Soldering of Copper and Copper Alloys80 \n
3.1概述Introduction80 \n
3.2钎焊性Brazability and Solderability84 \n
3.2.1纯铜Copper84 \n
3.2.2普通黄铜Brasses84 \n
3.2.3锡黄铜Tin Brasses84 \n
3.2.4铅黄铜Leaded Brasses84 \n
3.2.5锰黄铜Manganese Brasses84 \n
3.2.6锡青铜Tin Bronzes84 \n
3.2.7铝青铜Aluminum Bronzes84 \n
3.2.8铍铜Beryllium Copper85 \n
3.2.9硅青铜Silicon Bronzes85 \n
3.2.10铬铜和镉铜Chromium Copper and Cadmium Copper85 \n
3.2.11白铜合金Copper-nickel Alloys85 \n
3.3钎焊接头间隙Clearance of Brazed Joint85 \n
3.4软钎料Solders88 \n
3.4.1镓基钎料Gallium Based Solders88 \n
3.4.2铋基钎料Bismuth Based Solders89 \n
3.4.3铟基钎料Indium Based Solders89 \n
3.4.4锡铅钎料Tin Lead Solders89 \n
3.4.5无铅钎料Lead Free Solders94 \n
3.4.6高温锡钎料High Temperature Tin Solders106 \n
3.4.7铅基钎料Lead Based Solders107 \n
3.4.8镉基钎料Cadmium Based Solders107 \n
3.4.9金基软钎料Gold Based Solders108 \n
3.5硬钎料Brazing Filler Metals108 \n
3.5.1对钎料的基本要求Demands on Brazing Filler Metals108 \n
3.5.2钎料的分类Classification of Brazing Filler Metals108 \n
3.5.3钎料的型号与牌号Designations of Brazing Filler Metals108 \n
3.5.4银钎料Silver Filler Metals109 \n
3.5.5低银钎料Low Silver Based Filler Metals123 \n
3.5.6铜磷钎料Copper-phosphorus Filler Metals130 \n
3.6钎剂Fluxes135 \n
3.6.1钎剂的功能Functions of Brazing Fluxes135 \n
3.6.2对钎剂的基本要求Demands on Brazing Fluxes135 \n
3.6.3钎剂的分类及型号Classification and Type of Fluxes136 \n
3.7软钎剂Soldering Fluxes136 \n
3.7.1腐蚀性钎剂Corrosive Fluxes137 \n
3.7.2弱腐蚀性钎剂Medial Corrosive Fluxes138 \n
3.7.3无腐蚀性钎剂Non-corrosive Fluxes139 \n
3.8硬钎剂Brazing Fluxes140 \n
3.9表面准备Surface Preparation143 \n
3.10接头设计Joint Design143 \n
3.11钎焊方法和工艺Methods and Technology of Soldering and Brazing144 \n
3.11.1铜Copper144 \n
3.11.2黄铜Brasses144 \n
3.11.3铜和黄铜软钎焊接头强度The Strength of Copper and Brass Soldered Joints144 \n
3.11.4锰黄铜Manganese Brasses147 \n
3.11.5铍铜Beryllium Copper148 \n
3.11.6铬铜Chromium Copper148 \n
3.11.7镉铜和锡青铜Cadmium Copper and Tin Bronzes148 \n
3.11.8硅青铜Silicon Bronzes148 \n
3.11.9铝青铜Aluminum Bronzes148 \n
3.11.10锌白铜和锰白铜Copper-nickel Alloys149 \n
参考文献References149 \n
第4章电子工业中的软钎焊Chapter 4 Soldering in Electronic Industry151 \n
4.1电子制造与软钎焊Electronic Manufacture and Soldering151 \n
4.1.1软钎焊在电子工业中的地位The Position of Soldering Technique in Electronic Industry151 \n
4.1.2电子制造与电子封装Electronic Manufacture and Electronic Packaging151 \n
4.1.3电子工业中钎焊连接的特点及发展历程The Characteristic and Development Course of Soldering Technique in Electronic Industry152 \n
4.2软钎焊连接的基本原理Fundamental of Soldering154 \n
4.2.1软钎焊的定义Definition of Soldering154 \n
4.2.2钎料与母材间的相互作用Interaction Between Solder and Base