电路板基础技术手札

目录
概述 1
Overview
电子产品的结构 2
Electronic Products Structure
电路板的发展史 4
The Development of PCB Industry
电路板的应用 6
Application of PCB
电路板的分类 8
PCB Categories
电路板基础制程简介（刚性板篇） 9
Basic PCB Manufacturing Processes Introduction (Rigid Board Section)
典型的刚性多层板制程 10
Typical Rigid Multi-layer PCB Manufacturing Processes
开料 12
Issue Material
抗蚀层涂覆 14
Etching Resist Coating
贴干膜 16
Dry Film Lamination
内层图形转移 18
Inner Image Transfer
形成良好的光致抗蚀剂和图形侧壁 20
Forming Qualified Photoresist and Pattern Sidewall
显影、蚀刻、退膜线 22
Developing， Etching， Stripping Line
表面粗化（黑化） 24
Surface Roughening (Black Oxide)
铆合与预排 26
Riveting and Booking
层压叠板 28
Lamination Lay-up
热压 30
Hot Press
油压式热压机构 32
Oil Hydraulic Hot Press Structure
压板后处理 34
Lamination Post Treatment
机械钻孔 36
Mechanical Drilling
钻孔主轴（气体轴承） 38
Spindle for Drilling (with Gas Bearing)
钻孔和排屑负荷 40
Drilling Bits and Chip Loading
钻头的研磨及取放 42
Drilling Bits Re-Sharp and Setting
钉头及偏位(钻孔及电镀后) 44
Nail Head and Misalignment(After Drilling and Plating)
镀覆孔制程 46
Plating Through Hole Process
外层贴干膜 48
Dry Film Lamination in Outer Layers
外层曝光 50
Outer Layer Exposuring
图形电镀 52
Pattern Plating
外层图形制作 54
Outer Layer Pattern Creation
阻焊涂覆 56
Solder Resist Coating
金属表面处理（热风焊料整平和金手指电镀） 58
Metal Finish (Hot Air Solder Leveling and Gold Finger Plating)
电路板基础制程简介（挠性板篇） 61
Basic PCB Manufacturing Processes Introduction (FPC Section)
挠性板的应用 62
FPC Applications
典型的挠性板制造工艺和生产流程 63
Typical FPC Boards Manufacturing Processes & Production Sequences
挠性板的优势 64
FPC Strengths
挠性板中使用的不同铜箔 66
Different Copper Foils Used in FPC
挠性材料开料 68
Flexible Material Slicing
机械钻孔 70
Mechanical Drilling
镀覆孔 72
Plating Through-Hole
贴干膜 74
Dry Film Lamination
曝光 76
Exposuring
显影 78
Developing
蚀刻 80
Etching
退膜 82
Stripping
假接 84
Pre-lamination
热压 86
Hot Press
金属表面处理 88
Metal Finish
电气测试 90
Electrical Testing
成形 92
Contouring
检验 94
Inspection
组装 96
Assembly
包装 98
Packing
电路板的未来发展趋势 101
Future Development Trend of PCB
电路板的产业定位 102
PCB Industry Role
移动设备（便携式和可穿戴小型化） 103
Mobile Devices (Portable and Wearable Miniaturization)
IC封装的发展趋势 104
IC Package Development Trend
为何需要HDI技术 105
Why We Need HDI Technology
电路板结构的发展趋势 106
PCB Structure Development Trend
典型的线路设计发展趋势 107
Typical Pattern Design Development Trend
跨领域的思维 108