Preface vii
Acknowledgments xi
About the authors xiii
1Introduction 1
1.1Evolution of integrated circuit packaging 1
1.2Performance and design methodology for integrated circuit packaging 6
References 11
Further reading 12
2Electrical modeling and design 13
2.1Fundamental theory13
2.2Modeling, characterization, and design of through-silicon via packages 28
References 53
3Thermal modeling, analysis, and design 59
3.1Principles of thermal analysis and design 59
3.2Package-level thermal analysis and design 74
3.3Numerical modeling 89
3.4Package-level thermal enhancement 97
3.5Air cooling for electronic devices with vapor chamber configurations 101
3.6Liquid cooling for electronic devices 106
3.7Thermoelectric cooling 112
References 126
4Stress and reliability analysis for interconnects 131
4.1Fundamental of mechanical properties 131
4.2Reliability test and analysis methods 149
4.3Case study of design-for-reliability 227
References 239
5Reliability and failure analysis of encapsulated packages 245
5.1Typical integrated circuit packaging failure modes 245
5.2Heat transfer and moisture diffusion in plastics integrated circuit packages 245
5.3Thermal- and moisture-induced stress analysis 263
5.4Fracture mechanics analysis in integrated circuits package 270
5.5Reliability enhancement in PBGA package 282
References 290
Further reading 292
6Thermal and mechanical tests for packages and materials 293
6.1Package them叫tests 293
6.2Material mechanical test and characterization 306
References 322
7System-level modeling, analysis, and design 325
7.1System-level them叫modeling and design 325
7.2Mechanical modeling and design for microcooler system 348
7.3Codesign modeling and analysis for advanced packages 370
References 389
Appendix 1 Nomenclature 393
Appendix 2 Conversion factors 403
Index 405
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